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    Diffusion Bonding

    Heterogeneous metal bonding Plasma cathode and X-Ray tube anodes

    Diffusion bonding can achieve a reliable tungsten–copper bonding.
    This plasma cathode must withstand instantaneous temperatures above 10,000 °C and extreme mechanical stresses and ensure excellent heat transfer.
    ENERGINE provides the best diffusion bonding recipe to optimize high resistance to arc corrosion resistance, temperature and thermal conductivity.
    In addition, one of the most reliable applications of diffusion bonding is tungsten copper annealed, which ensures excellent heat dissipation and
    The X-ray tube must be fully bonded to ensure excellent durability.
    The energy provides a complete diffusion coupling solution for the X-ray anode and plasma cathode.

      Application example